Silicon Scribing

Silicon is widely used in a number of industries but primarily in solar cells and in semiconductor manufacture, with growing applications in jewellery and entertainment goods. In the majority of applications the source material is in the form of wafers which are typically 0.2-1.5mm (0.008”–0.06”) thick and 100-300mm (4”-12”) diameter.

Our redENERGY Pulsed Fiber Laser can be effectively used to cut or scribe silicon, with the 20W Laser also being capable of cutting blind slots or grooves in silicon.

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