|Laser||Power Demand||M²||Beam Ø||Scanner/Lens||Energy|
|redENERGY G4 50W HS-S||50W||<1.3||8mm||10mm aperture / 160mm F- theta||WF0 @100kHz|
The image shown is a 3x3mm square area which has been processed to a depth of 1.5mm in 92 seconds, representing a removal rate of 9mm3/min.
This high quality result has been achieved through the use of waveforms to maintain control of the engraving process. When engraving starts, waveform 1 is initially used in order to avoid a perimeter ridge around the engraved area. Consequently, once the engraved depth has reached around 0.2mm, waveform 0 is used since the material removal rate is higher than other waveforms.
Throughout this process, waveform 5 is regularly used to clean the engraved area which helps to remove dross and debris. After the engraving process has finished, the surrounding area is Laser cleaned using waveform 5 at 800kHz to remove any surface deposits.
Note that it is possible to use only waveform 0 for engraving without the use of additional cleaning waveforms. In this case the removal rate increases to 14mm3/min, however there is a loss in quality.
The workstation used a 75mm BEC which produced an 8.1mm (1/e2) diameter beam at the scanner entrance, allowing a 10mm aperture scanner to be used. The scanner was fitted with a 160mm focal length objective lens which gave a 100x100mm field size.
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