Application - 어블레이션
레이저 어블레이션은 단단한 금속과 공업용 화합물(예를 들어, 전자 제품에 사용되는 요소)에 레이저 빔을 조사하여 레이어를 제거하는 정밀 공정입니다. 레이저 광속이 느린 경우 흡수된 레이저 에너지로 재료가 가열되면 증발 또는 승화됩니다. 레이저 광속이 빠른 경우에는 일반적으로 재료가 플라스마로 변환됩니다. 일반적으로 레이저 어블레이션은 펄스 광섬유 레이저로 재료를 제거하는 것을 의미하지만 레이저 밀도가 충분히 높은 경우 지속파 레이저로 재료를 제거할 수 있습니다.
Fiber Laser Ablation in the Automotive Industry
Application InsightPosted on 22/09/2018
Use of fiber lasers in the automotive industry The increasing use of fiber lasers is simply due to the variety of impressive benefits that can be gained from the use of this technology. Fiber lasers and their applications offer a lot of... read more >
Fiber Laser Ablation in the Aerospace Industry
Application InsightPosted on 22/09/2018
Solid metals and certain compounds used in industrial applications sometimes require to have layers removed from them in order to enhance their suitability for industrial processes. The removal needs to be carried out with absolute precision and a... read more >
Fiber Laser Ablation in the Electronics Industry
Application InsightPosted on 22/09/2018
The case for fiber laser ablation The term laser ablation refers to the controlled removal of materials from a component. It is an accurate and high-speed process that uses fiber lasers to home in on the material and remove it. For example, the... read more >
Laser Ablation Applications
Application InsightPosted on 22/09/2018
Laser ablation is one of many types of laser process that our fiber lasers can perform here at SPI Lasers. While bearing many similarities to other processes, such as laser cleaning, it is an important method in its own right.It has grown to... read more >
Laser Ablation FAQs
Application InsightPosted on 22/09/2018
Laser ablation is just one of the many processes that can be performed using one of our very own SPI Fiber Lasers. It bears similarities to some other applications methods, and so we thought it important to have a dedicated section answering some of... read more >
Wire Insulation Stripping
Application PostcardPosted on 20/04/2018
The technique of wire stripping is common practice in the electronics industry, involving the removal of the insulating material layer surrounding an electrical wire. Wire stripping is performed in order to replace, repair or to re-connect a wire to... read more >
Thin Film Removal
Application InsightPosted on 14/10/2015
Thin film removal is the process of removing a very thin layer of material from a substrate. This process is used in a variety of different application areas, the most common being in the electronics and semiconductors industries.Our redENERGY... read more >
Etching Silver on Ceramic
Application PostcardPosted on 14/10/2015
Our range of redENERGY Pulsed Fiber Lasers can be used to isolate thick bright metal plating on top of ceramic. This allows users to quickly and cleanly create islands of electrical isolation which can then be used as substrates for electronic... read more >
