Silicon Cutting

Silicon is widely used in a number of industries but primarily in solar cells and in semiconductor manufacture, with growing applications in jewellery and entertainment goods. In the majority of applications the source material is in the form of wafers which are typically 0.2-1.5mm (0.008”–0.06”) thick and 100-300mm (4”-12”) diameter.

Using our 200W redPOWER R4 CW Laser cutting speeds of up to 10m/min can be achieved in polycrystalline silicon of 200µm (0.008”) thickness, yielding extremely smooth cut edges which exhibit no signs of cracking. Kerf widths of 40µm can be achieved which are very parallel sided and exhibit no signs of edge chipping. Even at thicknesses of 1.2mm (0.005”) cutting speeds in excess of 1m/min can be achieved, which is competitive with all other silicon cutting existing technologies.

Share article on...
Case Study

Product Solution – redPOWER R4

redPOWER R4

업데이트 정보 수신 등록

If you enjoyed reading this article, why not register for future articles?

arrow