Silicon Scribing with Fiber Lasers

Silicon is widely used in a number of industries but primarily in solar cells and in semiconductor manufacture, with growing applications in jewellery and entertainment goods. In the majority of applications the source material is in the form of wafers which are typically 0.2-1.5mm (0.008”–0.06”) thick and 100-300mm (4”-12”) diameter.

Our redENERGY Pulsed Fiber Laser can be effectively used to cut or scribe silicon, with the 20W Laser also being capable of cutting blind slots or grooves in silicon.

Share article on...

Product Solution – redENERGY


업데이트 정보 수신 등록

If you enjoyed reading this article, why not register for future articles?