레이저는 실리콘 웨이퍼를 비롯한 광범위한 재료 용입에 필요한 정확성 및 다용성을 제공합니다. 적층 가공은 최근 반도체 분야에 새로운 깊이를 탐색하고 있으며, 종래의 기술을 뛰어넘는 다양한 장점을 제공합니다. 여기에는 기하하적 복잡성이 높고 강력하지만 경제적인 부품 제작이 포함됩니다. 실리콘 웨이퍼 절삭은 반도체 부문에서 일반적으로 사용되는 애플리케이션으로 redENERGY 100W 펄스 레이저를 활용할 수 있는 적용 분야입니다.
Posted on 11/10/2018
Lasers have become an incredibly important part of the semiconductor industry. As the industry has grown, so too has its need for efficient, reliable and cost-effective processes to match demand. Lasers were the obvious solution for this, and they... read more >
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