Precision Cutting, Dicing and Scribing Wafers
Lasers have been used to process wafers for many years. The main benefits of using a Laser are:
- Faster processing times;
- Smaller kerf widths;
- Minimal dross;
- No micro-cracking;
- Ability to process different wafer materials and thicknesses.
Our range of redENERGY Fiber Lasers can cut thin silicon wafers at high speeds with minimal cracking and Heat Affected Zone.
The redENERGY 100W pulsed Laser can deliver a unique pulse shape which limits the plasma effects associated with cutting silicon wafers. The Laser is designed to cut silicon wafers up to 1mm thick with a kerf width of approximately 100 microns.
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