Mithilfe von Lasern lässt sich die nötige Präzision und Vielseitigkeit erreichen, um eine Vielzahl von Materialien zu durchdringen, darunter auch Siliziumwafer. In der Halbleiterindustrie zeichnen sich derzeit ganz neue Spielräume dank additiver Herstellung ab, die verschiedene Vorteile gegenüber konventionellen Verfahren aufweist. Unter anderem lassen sich so Bauteile herstellen, die geometrisch komplexer, stabiler und dennoch kostengünstiger sind. Das Schneiden von Siliziumwafern findet häufig Anwendung in der Halbleiterindustrie. redENERGY 100W-Pulslaser sind für diese Aufgabe konstruiert.

In 2019 SPI Lasers were approached by Pyramid Engineering to supply an evaluation laser for a new welding system being developed for a telecommunications customer (Fig 1).As a leading designer & integrator of high precision welding systems... read more >

As can be seen, semiconductors have many engravings in them

Laser Engraving in the Semi-conductor Industry

Application Insight
Posted on 11/10/2018

Lasers have become an incredibly important part of the semiconductor industry. As the industry has grown, so too has its need for efficient, reliable and cost-effective processes to match demand. Lasers were the obvious solution for this, and they... read more >

Lasers are used throughout the semiconductor industry, and they play a crucial role in many process stages. Here you will find an overview of their use in the industry, but our primary focus is on the application of fiber lasers in wafer dicing;... read more >

Additive Manufacturing in the Semiconductor Industry

Application Insight
Posted on 25/11/2015

The technology to use additive manufacturing has been around for more than three decades, but it’s only quite recently that it’s been possible to explore this in more depths.A number of different industries have benefitted from this... read more >

Precision Cutting, Dicing and Scribing of Silicon Wafers

Application Insight
Posted on 06/11/2015

Lasers have been used to process wafers for many years. The main benefits of using a Laser are:Faster processing times; Smaller kerf widths; Minimal dross; No micro-cracking; Ability to process different wafer materials and... read more >