Semi Conductors

Semiconductors must be constructed using precision and versatility, especially due to the penetration of materials like silicon wafers, which is a service that fiber lasers can offer better than any alternative. Alongside this, additive manufacturing has allowed for new techniques and practices to be adopted within the semiconductor industry such as creating parts which are more complex and stronger.

Semiconductor industry uses and applications of the fiber laser industry

Fiber lasers can be used in many stages of semi-conductor production. Here we summarise how fiber lasers can be beneficial in this industry.

Semiconductors actively benefit from marking and engraving techniques. Traditionally, engraving has tended to cause abrasion “wear and tear”, fiber lasers avoid this as the approach is non-contact. The quality of the mark or engraving is perfect, with incredibly small marks also being possible. The main distinction between marks and engravings is the depth, with marks being at the surface level and engravings being deep (and below the surface).

A major application for semiconductors is cutting. Silicon, in particular, is cut to very precise dimensions using fiber lasers. Often called scribing, fiber lasers deliver absolutely minimal cracking, minimal waste and low levels of thermal distortion compared to other methods.

Any surface-level contaminants or debris can be ablated or cleaned off using a fiber laser. This is especially important considering the electrical conductive requirements needed by semiconductors.

Watch our video which shows the fiber laser cutting of silicon with a redENERGY G4 20W EP-Z Pulsed Fiber Laser

Read our guide to additive manufacturing in the semiconductor industry, for details of how semiconductors can be 3D printed using fiber lasers.

SPI Lasers and the semiconductor industry

Our redENERGY 100W Pulsed Laser has been designed with plenty of applications in mind, delivering robust, efficient and reliable solutions; making it the perfect laser for something like cutting silicon wafers. See what our lasers can do below.

The range of pulsed and continuous wave fiber lasers available from SPI Lasers can be used in a wide variety of applications. From marking and cutting, through to welding and 3D printing, to name but a few.

Other laser applications include ablation, cleaning, drilling and engraving. Contact SPI Lasers now to learn how we could support your organisation with innovative laser equipment to use in the semiconductor industry.

Added below are a range of semiconductor industry application insights and postcards, which will enrich the knowledge of readers about the use of fiber lasers in this industry.

In 2019 SPI Lasers were approached by Pyramid Engineering to supply an evaluation laser for a new welding system being developed for a telecommunications customer (Fig 1). As a leading designer & integrator of high precision welding systems... read more >

As can be seen, semiconductors have many engravings in them

Laser Engraving in the Semi-conductor Industry

Application Insight
Posted on 11/10/2018

Lasers have become an incredibly important part of the semiconductor industry. As the industry has grown, so too has its need for efficient, reliable and cost-effective processes to match demand. Lasers were the obvious solution for this, and they... read more >

Lasers are used throughout the semiconductor industry, and they play a crucial role in many process stages. Here you will find an overview of their use in the industry, but our primary focus is on the application of fiber lasers in wafer dicing;... read more >

Case Study

Additive Manufacturing in the Semiconductor Industry

Application Insight
Posted on 25/11/2015

The technology to use additive manufacturing has been around for more than three decades, but it’s only quite recently that it’s been possible to explore this in more depths. A number of different industries have benefitted from this... read more >

Case Study

Precision Cutting, Dicing and Scribing of Silicon Wafers

Application Insight
Posted on 06/11/2015

Lasers have been used to process wafers for many years. The main benefits of using a Laser are: Faster processing times; Smaller kerf widths; Minimal dross; No micro-cracking; Ability to process different wafer materials and... read more >